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Binders for semiconductor packaging

Bonding adhesive

Haodian Technology Temporary Bonding Adhesive-Technical Specifications:


TBA001

TBA003 (stronger UV absorption)

color

reddish

brown

Spin-coat thickness

1-3μm

curing condition

300-350°C, 10 minutes

withstand temperature

＞300℃

CTE（ppm /°C, below Tg).

64.8

-

Young's modulus (GPa).

＞2

-

Breaking strength (MPa).

＞50

-

debonding wavelength

355nm

debonding energy

~450mJ/cm2

~300mJ/cm2

application areas

FOWLP，2.5D，3D


For details, please contact our staff.

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    Guangdong Province Room 1008, Building 31, Science and Technology Park

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