产品3
For electronic components

Low-temperature decomposition binder

◎ Saturated carbon chain structure design, containing various functional groups such as thermal decomposition and polarity;
◎ It has good compatibility with ceramic powder and good adhesion;
◎The initial decomposition temperature is about 250°C, which is easy to decompose and has low residue.

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Technical Specifications

ModelStatusMw. x104Tg( °C)Initial Decomposition Temperature
HDC110
White powder
30±1060±10 °C~250 °C

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